COLOP will present new product at major exhibition

Colop UK will be presenting its new jetStamp 1025 at the Packaging Innovations Conference 2019.

The stamp can print up to a height of 25mm. This makes it ideal for marking large surfaces such as pallets and cardboard. However, will be revealed at Packaging Innovations Conference 2019, at Birmingham’s NEC on 27 and 28 February 2019.

The stamp’s USP is in the diverse print spectrum. It includes freely adjustable continuous 1-D and 2-D barcodes, dates, times, texts, numbers or graphics, such as the IPPC logo or company logo.